Feature Highlights:

Battle Ax Backplate: Improved backplate design that provides structural rigidity and passive heat dissipation.

Hollow Back Panel: A hollow back panel design that allows airflow to freely pass through the heatsink. This design greatly improves heat dissipation compared to conventional GPU air cooling designs.

Efficient Airflow: With triple fans to improve air pressure and inlet volume, supporting auto-stop technology.

Reflow Soldering Technique: The process ensures that the thermal tube and the fin fit perfectly, optimizing heat dissipation performance and achieving excellent heat dissipation effects.

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